We cordially invite you to join us at the Hilton San Francisco Union Square at the 64th International Electron Devices Meeting (IEDM 2018). We are exhibiting at booth #11.

Silvaco technology experts will be available to discuss our TCAD-to-signoff solutions with emphasis on new products and capabilities serving Power, Display, Radiation and advanced CMOS technologies.

Learn about some recent use cases of our 3D TCAD products. We will be showcasing:

  • 3D large structure simulation of power devices (multiple cells and edge termination)
  • 3D topographical simulation for memory applications – 3D NAND Flash, STT-MRAM
  • SiC and GaN power device 3D simulation, including mixed-mode TCAD-SPICE simulation
  • SEE, Total Dose simulation for radiation hardened applications
  • TMM and FDTD simulation for displays
  • 3D pathfinding simulation for FinFETs
  • 3D field solver based RC extraction for 10nm FinFET SRAM

Silvaco and Purdue Team Up to Bring Scalable Automistic TCAD Solutions for Next Generation Semiconductor Devices and Materials

What: Reception Hosted Bar
When: Monday December 3rd
Time: 5:00pm -6:30pm
Where: Union Square #20, Tower 3 on the 4th Floor